To:
All VI Customers

With the deadline for the European RoHS directive fast approaching, it is Vectron's intent to fully support the requirements of this directive, and to offer RoHS compliant product. The primary reason for current non-compliance of Vectron product is the presence of lead, from sources such as:

• Lead-based solder alloy materials used for product assembly, e.g. Sn63 or Sn60
• lead-based terminations on externally procured components, such as on discrete passive devices and packaged IC components
• lead based finish on product terminations, intentionally added such as by dipping prior to shipment to customers

Product is compliant to RoHS directive

In conjunction with the RoHS compliance plan Vectron also intends to offer product that is lead free and is compatible with the high temperature reflow requirements for lead-free products. These generally include:

• capable of surviving peak reflow temperatures to 260°C, depending on product geometry/volume per J-STD-020C
• moisture sensitivity level classification and identification
• lead-free status identification, such as labeling and/or new distinguishing part numbers

	Product is compliant to RoHS directive
	and fully compatible with lead free assembly

In general, Vectron will utilize the date code of cut-over and/or package labeling to identify the transition of a product to an equivalent RoHS-compliant and/or Pb-free version if not currently compliant, for standard catalog items. Vectron will however also review any customer requirements for a new part number to identify equivalent RoHS-compliant and/or Pb-free versions and may offer alternate part numbers for custom products.

A brief status of Vectron's current product offering and targets for RoHS compliance and lead-free development/replacement plans are shown in Attachment 1. Vectron is also revising product data sheets for compliant parts, which can be found on the Vectron web site.

USE OF EXEMPTIONS/EXCEPTIONS

Some telecomm customers have indicated that they intend to use the permitted application exemption in the RoHS annex that allows, among others, the use of lead in solder used in equipment and components for network infrastructure. Military and space customers have also indicated that they will continue to procure product with current lead-based assembly technology due to concern with the lead-free solder alternatives and have requested no change to the product. VI will support such requests where practical. However, customers are advised that maintenance of two different products in the future, both lead-based and its lead-free equivalent or replacement offering the same function, will result in significant logistical and operational costs that will be passed on to customers who wish to continue to order the older lead-based product. The unavailability of externally procured components, as some suppliers elect to discontinue the offering of current Pb-based product, will further exacerbate the issue.

WEEE DATA:

Several other legislations driven by end-of-line recycling and disposal considerations, such as WEEE, ELV require product material/substance analysis. In some cases some customers have adopted certain industry standards for reporting of material data such as the AIAG standard and IMDS database. These database(s) require comprehensive product bill of material information and substance analysis to be captured in a defined format so that the information can be uploaded into a master data base and aggregated to establish the material information at the system level. It is Vectron's intent to make such information available and certify to the accuracy of the information to the best of its knowledge but Vectron assumes no liability from the use of such information provided.

If you need any additional information regarding this notification, please contact your VI Marketing & Sales Representative.